三维集成技术及其生物医学应用研究 报告人:Prof. Tetsu TANAKA
三维集成技术及其生物医学应用研究
三维集成技术及其生物医学应用研究
3D Integration Technology and Its Application to Biomedical Integrated Devices
报告人:Prof. Tetsu TANAKA
(Graduate School of Biomedical Engineering Tohoku University, JAPAN)
主持人:裴艳丽副教授
摘要:
Semiconductor neural engineering is a discipline that uses semiconductor process/device/circuit technologies to further understand properties of neural systems and to create novel fusion systems of living body and machine. One of the goals in my laboratory is to establish semiconductor neural engineering and develop biomedical mi-cro/nano systems including:
1. Intelligent Si neural probe and brain-machine interface 2. Fully-implantable retinal prosthesis system . 3. Bio/nano technology and novel Bio-FET sensor 4. 3-D integration technology and Analog/Digital LSI design.
In this presentation, I will talk about overviews and current research results of 3D integration technology including reliability evaluation. I will also mention its application to biomedical integrated devices such as fully-implantable retinal prosthesis, intelligent Si neural probe, and bio-FET sensor.
报告人介绍:
Tetsu Tanaka received the B.S. and M.S. degrees in electronics engineering and the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Sendai, Japan, in 1987, 1990, and 2003, respectively. In 1990, he joined Fujitsu Laboratories, Ltd. From 1994 to 1995, he was a Visiting Fellow with University of California, Berkeley. In 2005, he moved to the Tohoku University as an Associate Professor, and became a Professor of Graduate School of Biomedical Engineering, Tohoku University in 2008.
报告时间:2016年4月22日 上午10点-12点
报告地点:广州大学城最热门的网赌网址大全纳米楼306室
欢迎各位老师同学参加报告会!